KONIG Pioneers 3D Digital Packaging Solutions for the Electronics Industry
By Wendy Xu, Marketing Supervisor
Founded in 2010 and headquartered in Suzhou, China, KONIG has carved out a distinct niche in the electronics industry by redefining what’s possible in packaging technology. The company specializes in advanced packaging protection for sensitive electronic products, and over the past decade, it has built a reputation for excellence, innovation, and reliability. With over 150 employees and a 9,000 sq m state-of-the-art manufacturing facility, KONIG supports its global customer base with a comprehensive suite of services centered around 3D digital packaging solutions.
At its core, KONIG exists to solve one of the most persistent challenges in electronics manufacturing: how to protect intricate, miniaturized components while maintaining production efficiency and environmental sustainability. The company’s in-house development of 3D UV-curable glue deposition technology positions it at the forefront of this challenge.
KONIG’s flagship solution is its 3D digital packaging system, which is an advanced method that replaces traditional manual or semi-automated conformal coating and masking procedures. This system leverages high-speed, high-precision jetting of UV glue in targeted areas to create protective three-dimensional structures. By using computer-controlled deposition and multi-layer stacking techniques, KONIG delivers a level of detail and adaptability that legacy systems simply can’t match.
According to President Jason Zhu, “This technology fundamentally changes how electronics manufacturers think about protective packaging. We enable faster production, higher precision, and lower cost, all while achieving better protection performance.”
KONIG’s 3D digital packaging system offers key advantages that translate directly into value for manufacturers:
• Unmatched Precision: Operating at an injection resolution of 400 dpi and capable of producing layer thicknesses as fine as 15 µm, KONIG’s system is ideal for today’s densely packed, miniaturized electronic assemblies.
• High-Speed Production: With a drop frequency of up to 20,000 times per second and an ability to produce fully hardened protection layers within 10-30 seconds, the system supports high-throughput production lines without sacrificing quality.
• Cost and Labor Reduction: By eliminating traditional masking steps and reducing material usage,
KONIG’s technology can lower packaging costs by more than 40%. Masking eliminates overspray, which is wasted material. The automation also reduces dependence on manual labor, contributing to more consistent quality and greater throughput.
• Modular Design: The digital packaging equipment can be easily integrated into existing SMT production lines or tailored into standalone solutions, offering flexibility for both high-volume OEMs and specialized contract manufacturers.
KONIG’s solutions are tailored for a comprehensive range of applications across the electronics landscape. Its technology has been adopted by manufacturers in:
• Surface Mount Technology (SMT): Especially useful for protecting complex assemblies post-reflow without interfering with neighboring components.
• Semiconductor Packaging: Delicate chips and wafer-level packages benefit from KONIG’s non-invasive, accurate glue application that shields without adding excess bulk.
• Consumer and Industrial Electronics: From smartphones to smart appliances, KONIG’s solutions ensure products withstand moisture, dust, vibration, and temperature extremes.
• Automotive Electronics: KONIG’s robust encapsulation systems meet the demands of automotive-grade electronics, including performance under high heat, humidity, and vibration.
Jason Zhu said, “Our technology is versatile. Whether our client is producing FPC boards for smartphones or modules for EVs, we deliver protection and precision that scales to their needs.”
At KONIG, quality isn’t an afterthought; it’s built into every layer of the process. The UV glue used in the process is formulated by KONIG itself, further allowing it to control product quality and tailor materials to the unique demands of each application. These proprietary UV adhesives come in various chemistries, including epoxy, acrylic, and hybrid, and can be adjusted in terms of viscosity, curing time, and mechanical strength.
The company adheres to stringent international standards, including:
• GB/T 9286-1998 for coating adhesion performance
• IEC 60068 for high-temperature and humidity reliability
• Salt spray testing, thermal shock testing, and UV aging tests
Each of these test regimens ensures that the UV adhesive materials and finished products maintain their integrity over time and under harsh conditions. These certifications and testing protocols have become a cornerstone of KONIG’s customer trust.
“In the electronics world, failures aren’t just costly, they’re catastrophic,” added Jason Zhu. “Our goal is zero defect protection that supports reliability and peace of mind.”
Environmental responsibility is an increasingly critical concern for electronics manufacturers, and KONIG’s solutions are designed to support green manufacturing practices. Its digital packaging systems are solvent-free and significantly reduce material waste, energy usage, and emissions.
Unlike traditional coating processes that require solvent-based materials and generate substantial chemical waste, KONIG’s UV adhesives are cured using energy-efficient LED UV. There’s no need for masking, which eliminates waste generated from tapes and discarded protective materials.
“Every drop of glue is intentional,” Jason Zhu said. “We’re proving that high-performance packaging can also be clean and sustainable.”
KONIG continues to invest in R&D, exploring new adhesive chemistries and refining its digital packaging equipment. Its roadmap includes smarter automation systems, AI-driven inspection modules, and expanding its material compatibility to include more exotic or flexible substrates.
As the electronics industry continues to evolve toward miniaturization, higher reliability, and smarter manufacturing, KONIG’s role becomes even more vital. “Our unique combination of precision engineering, proprietary materials, and customer-centric service positions makes us not just a supplier, but also a strategic partner to some of the world’s most demanding manufacturers,” concluded Jason Zhu.
For more information, contact Gavin Peterson, Managing Director/Partner, at Suzhou KONIG US; 386-585-0355; E-mail: info@konig.hk; Web site: www.konig.hk.