1CLICKSMT Highlights Hipri Stencil Printers & HiFlow Reflow Ovens for SMT Production
DONGGUAN, CHINA ― September 2026 ― 1CLICKSMT Technology Co., Ltd. is highlighting two key areas of its SMT equipment portfolio: the Hipri series of fully automatic stencil printers and the HiFlow series of lead-free reflow ovens. Designed to support reliable and efficient SMT production, the systems combine precision process control with features intended to simplify operation, maintenance and production-line integration.
Stencil printing and reflow soldering are fundamental stages of SMT assembly. Stencil printing establishes the foundation for consistent solder paste deposition, while reflow provides the controlled thermal profile required to create reliable solder joints. 1CLICKSMT offers multiple configurations within both equipment families to accommodate varying board sizes and production requirements.
The company’s Hipri series includes the Hipri-350, Hipri-350plus, Hipri-510Pro, Hipri-510plus, Hipri-600plus, Hipri-1200, Hipri-1500 and Hipri-2000 fully automatic stencil printers. These printers incorporate features focused on positioning accuracy, repeatable printing and efficient changeover. Depending on the model, positioning accuracy ranges from ±7-12 µm, while printing accuracy ranges from ±15-25 µm. Core cycle times are as low as seven seconds, excluding printing and cleaning.
The Hipri platforms feature high-rigidity integrated metal frames, electrically driven dual screw rods for rail-width adjustment and Z-axis direct servo drives for controlled lifting and snap-off movement. Higher-performance models also incorporate ball-screw and direct servo technology for squeegee movement, with optional closed-loop squeegee-pressure control.
The systems support multiple cleaning modes, including drop-type cleaning and dry and wet vacuum options. Board-size capabilities vary by model, with the Hipri-510Pro accommodating boards up to 510x510 mm and an optional 600x510 mm capability, while larger Hipri platforms support substantially larger boards.
Complementing the stencil-printing portfolio, the HiFlow series includes HiFlow-800, HiFlow-1000 and HiFlow-1200 configurations, along with dual-rail versions. The ovens provide eight, 10 or 12 top and bottom heating zones, respectively, as well as three top and three bottom cooling zones.
The heating system uses controlled air circulation, dynamically balanced three-phase motors and frequency-adjustable airflow. Independent control of heating, preheating and cooling airflow is supported, while an 8 mm aluminum heating plate helps promote stable temperature distribution.
Temperature control uses PID closed-loop control with PC and PLC operation. The system operates from room temperature to 300°C, with stated temperature-control precision of ±1°C and PCB temperature deviation of ±1.5°C based on the RM board test standard. Process data and equipment status can also be stored for production reference.
The conveyor system incorporates rail-width adjustment mechanisms, hardened guide rails and an in-rail returning-chain design for stable PCB transportation. A double-row transport chain helps reduce heat absorption at PCB edges, while optional central support is available for applications requiring additional board support.
Additional features include three top and three bottom cooling zones, optional water chilling, dedicated waste-heat exhaust, flux recovery and real-time closed-loop conveyor-speed control.
Together, the Hipri and HiFlow platforms give SMT manufacturers equipment options for two critical production processes, with configurations designed to accommodate different board sizes, throughput requirements and manufacturing environments. For more information, visit www.1clicksmt.com.